Process Engineer

Thintronics is solving one of the defining challenges in modern computing: moving massive amounts of data and power between chips at unprecedented speeds and densities. As Moore's Law slows, performance is increasingly defined by advanced packaging, chiplets, and high-density substrates. Our materials technology enables new levels of interconnect density, signal integrity, and power delivery inside next-generation semiconductor packages. We partner directly with leading IDMs, foundries, substrate manufacturers, and OSATs building the most advanced AI and HPC platforms in the world.

About the Role

This is a hands-on process integration and applications engineering role for engineers who are equally comfortable on the substrate manufacturer and OSAT floor and in customer technical reviews. You will own the integration and optimization of Thintronics materials into customer production flows — designing DOEs, troubleshooting process excursions, and translating fab-floor findings into actionable feedback for the R&D teams (Chemistry, Materials Science, and Materials Analytics). You will also serve as a primary technical interface between Thintronics and its substrate manufacturer and OSAT partners, supporting customer demonstrator builds, qualifications, pilot builds, and production ramp activities. This role requires frequent travel between the U.S. and substrate manufacturers and OSATs in Asia (Japan, Taiwan, and Korea); candidates should expect an average of 25–30% international travel on a recurring basis